1 ． the mercury content of Compact fluorescent lamps should not exceed
5 mg / lights

2 ． mercury content of general purpose of the straight tube fluorescent may
 not exceed:

-- Salt phosphate 10 mg

-- Normal three phosphate 5 mg

-- Long-term effectiveness three phosphate 8 mg

3 ． mercury content of special purpose of the straight tube fluorescent

4 ． This not specifically mentioned in the appendix of the other lights in mercury content

5 ． lead content of Cathode ray tubes, electronic components and Luminous
glass tube

6 ． Steel alloy elements in the lead content of 0.35%, aluminum content of 0.4%, copper alloy of lead content of 4%;

7 ． -- High-temperature melting of lead solder (ie: Sn-Pb solder alloy of lead
content over 85%);

-- For servers, storage systems and the memory of lead solder (exemption
granted to 2010);

-- For switching, signaling and transmission, and telecommunications network
 management network infrastructure equipment in the lead-free solder;

-- Electronic ceramic products in the lead (for example: high-voltage electronic
devices); (Which in 2005/747 / EC made an amended)

8 ． According to modification   about the limitation of specific hazardous
substances and the use of pre-manufactured sales and the 76/769 / EEC
Directive section 91/338 / EEC Directive which are prohibit the cadmium plating
outside. (Which in 2005/747 / EC made an amended)

9 ． Hexavalent chromium as carbon steel cooling system preservatives in the
Absorption refrigerators

10 ． In accordance with the procedures section in 7 (2), the European
Commission should evaluate the application of the following:

--Deca BDE

-- mercury content of special purpose of the straight tube fluorescent

-- The lead of Following used solder: Servers, storage, exchange and
transmission used in the network infrastructure, telecommunications, network
management equipment (set this directive seeks to exempt part of the specific
cut-off time);

-- Lamp.

11 ． The lead used in clockwise connexion system

12 ． The lead used in Thermal conductivity of the nail gun module and coat

13 ． The lead and cadmium used in optical glass and glass filter

14 ． The lead of Microprocessor-pin package and used by the Connexion
containing 80-85% lead compound (containing more than two kinds of
components) of solder

15.The lead used in Flip-chip packaging in the semiconductor chip carrier and
reliable connection between the formation of solder

16 ． The lead used in Portland band linear incandescent lamp casing

17 ． The lead halide used in Professional copiers in the high-density discharge
lamp as a light

18 ． The lead used in Professional uses discharge lamp phosphors as a catalys

19 ． The lead used in Small energy-saving [FS:PAGE]lamps in the amalgam with special ingredients

20 ． The lead oxide used in LCDs to connect in front of and behind the
fluorescent lamp in glass